MECHANICAL WAFER PICKS
WHS-G1
MECHANICAL WAFER PICKS
Wafer Size:100-125 MM
150 MM
200 MM
50-76 MM
Normally-Closed Edge Wafer Handling
Ergonomic Safe Wafer Handling
Perfluorocarbon 3 mm front side touchpad
Antistatic material construction
GRIP:
EDGE GRIP
EDGE
GRIP WITH SPATULA
Specialty wafer handling - General edge only handling of bonded, double topography, Taiko, optical, TSV, MEMS and other wafers that cannot be handled by a backside contact handling methods.
Rescue - Rescuing wafers that are stuck inside a process tool or automation.
Standard handling - Manually transferring, sorting, and loading wafers in a wafer fab. Works for both silicon and compound wafers.
Inspection - Sample inspecting wafers for macro defects, particles, and scratches, which typically requires operators to inspect under specialized lighting.
Economical handling tool - Used as cost-effective and portable alternative to a vacuum wands for general wafer handling applications; and as a replacement for tweezers which leave scratches behind.
A normally closed (consistent-Force) edge exclusion mechanical pick For handling 50 mm up to 200 mm round substrates from the wafer edge. The gripper material is ESD-safe PEEK For longevity, antistatic properties, and general chemical resistance. The wafer contact pad is perfluoro elastomer strip for grip hold on the wafer without scratching or leaving out-gassing behind. ISO Class 4.
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