스핀코터(Spincoater) 마스크얼라이너(Mask Aligner) 파릴렌코터(Pparylene Coater)

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APT SPIN150 

APT SPIN150i
 
  • Ideal for Process R&D
  • Material Size: Ø6”or 5”square
  • RPM: 1 ~12,000 rpm
    (for mechanical/non-vacuumchuckswe recommend max. 3.000rpm)
  • program:unlimited programs with max.unlimited step
  • Accuracy (+/- 1 rpm),Digital control Stepping Motor
  • Chemical resistant NPP Bowl
  • Digital Process Controller-easy step-by-step
  • Programmable Digital Acceleration/Deacceleration 30,000 rpm/sec
  • Clear Lid with 19mm center hole
  • Drain Port, Nitrogen Purge Port
  • Specially designed Bowl for Anti-Reflection & Reducing the the airflow to zero
  • Safety Door Interlock:Rotating stops when opening door
  • German-APT Made CE-approved
  • chuck :4-6''wafer
  • 용도 : High Uniformity 요구되는웨이퍼 PR 코팅,유기박막코팅,
    ITO Glass 박막코팅



  • 작동 모습



    Determination of spincoating uniformity and wafer to wafer uniformity of the APT Spincoating system using AZ5214E resist.
    ( By: T. Zijlstra TUDelft B. de Lange TUDelft B. van Weelde SPS )

    - APT Spincoater의 특징
    Wafer uniformity의 향상을 위한 2 Point

    1. acceleration during ramp up: Changing the acceleration resulted in more smooth resist films,
    i.e. “comet” tails disappeared when the acceleration during ramp up was increased to 1000 rpm per second, with a final spinning speed of 5000 rpm.

    2. Airflow in the spinbowl: Reducing the the airflow to zero resulted in circular uniformal resist pattern on the wafer

  • Wafer to wafer uniformity:
    ** For these experiments we used the “optimized” conditions,
    i.e. a ramp up of 1000 rpm per second for five seconds, then a spinning speed of 5000 rpm for 55 seconds.
    The airflow in the spinning bowl was reduced to zero.


    1. The spinning conditions for AZ 5214E was optimized, although we are convinced that conditions could have been further optimized if we would have had more time available.
    2. The wafer uniformity found, is better than 2.5%
    3. The wafer to wafer uniformity was found to be 3%.
    4. Improving the experimental setup would probably resulted in better wafer uniformity and wafer to wafer uniformity.



 

 
 
 

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