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Model BTF-144-PEL liquid resist
PRINT-ETCH FACILITY
Mounted on JSi's easily installed, easily relocated bases, the JSi Bench Toppers become a totally pre-engineered "in house" printed circuit facility, ready to run print-etch circuit boards in minutes. Work flow, equipment requirements and room or area layouts are easily determined upon decision to use convenient JSi Photosensitized Copper Clad or to "in house" coat photoresist. To operate the facilities as pictured, only 115V AC, 20 Amp., line services are required. This photo depicts the units that comprise a liquid resist print-etch facility. Remember that each of these units can be purchased individually.
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Designed to produce single or double
sided PCB's up to 12" x 12". Solvent process provides
maximum detail at minimum cost. Units as pictured on the BTB-501A
base are: BTC-101, BTO-102 and BTX-200A. Pictured on
the BTB-502A base are: BTD-201, (2) BTR-203, BTE-202 and BWD-204.
Also included, but not shown are the MS-6 Shear and MS-PH6
Six-Hole Punch. |
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Shipping
weight - 795 lbs. |
PEL-FCP Liquid Resist Chemical Package
Complete set of Liquid Resist start up chemicals and supplies includes: (4) KPR3-1QT photoresist, (1) KOR-T-1G thinner, (1) KD-1G solvent developer, (2) SP-20G sodium persulfate etchant and (1) PRSK-1G stripping solution.
Shipping Weight - 165 lbs.
Part No. PEL-FCP
Model BTF-144-PED dry-film
PRINT-ETCH FACILITY
Mounted on Kepro's easily-installed, easily-relocated bases, the Kepro Bench Toppers become a totally pre-engineered "in house" printed circuit facility, ready to run print-etch circuit boards in minutes. Work flow, equipment requirements and room or area layouts are easily determined upon decision to use convenient Kepro Photosensitized Copper Clad or to "in house" coat photoresist. To operate the facilities as pictured, only 115V AC, 20 Amp., line services are required. This photo depicts the units that comprise a dry-film resist print-etch facility. Remember that each of these units can be purchased individually.
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Designed to produce single or double
sided PCB's up to 12" x 12". Full aqueous process
eliminates all solvent fumes and contamination. Units as pictured
include: MS-6, BTL-121A and BTX-200A. On the BTB-502A
base: BTD-201B, (2) BTR-203, BTE-202 and BWD-204. Also
included, but not shown is a MS-PH-6 Pilot Hole Punch. |
Electrical
requirements: 115V AC, |
Shipping
weight - 580 lbs. |
PED-FCP Dry-Film Chemical Package
Complete set of Dry Film start up chemicals and supplies includes: (1) DFR-15 dry film photoresist, (2) DFD-12G dry film developer, (2) DFS-12G dry film stripper, (2) SP-20G sodium persulfate etchant and (1) AZK-F-1QT defoamer.
Shipping Weight - 165 Ibs.
Part No. PEL-FCP
PLATE-THRU FACILITY
SAME DAY PLATE-THRU HOLES on panels up to 12" x 12" in size can be processed through the JSi Plate-thru facility. Processing time, exclusive of mechanical fabrication, pattern masking, mask strip and etching is approximately two hours. The JSi Plate-thru facility is designed to be compatible with the JSi Bench-top Dry-Film Print-Etch facility, with "in House" dry film application, as pictured above.
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All equipment is pre-plumbed to a single water inlet
and to a common drain location. Electrical connections for
individual bench-top units terminate at two 115V AC, 60 HZ, 20 Amp.,
line cords. |
Electrical
requirements: 115V AC, |
Shipping weight - 1300 lbs. |
PTH-FCP ... PLATE-THRU
Start Up Chemicals & Supplies PackageINCLUDES: (1) CCH-3.5G PTH cleaner; (1) AP-24G, ammonium persulfate, (2) ACT-1G activator; (1) ACC-3.5G accelerator, (1) ECU-1OG electroless copper, (2) CU-5G copper electrolyte, (1) CU-4A set of 4 copper anodes, (1) CU-8-1QT copper brightener, (2) PBSN-5G solder electrolyte, (1) PBSN-4A set of 4 solder anodes and (2) AB-4 set of 4 anode bags.
Shipping Weight - 365 Ibs.
