The JTF 350 is a highly versatile, easy to use, convective soldering/desoldering system that does not require nozzles.
Capable of removing any type of surface mount component, including area array devices, and surface mount connectors up to 2" (50mm) long. The JTF 350 can also be used toinstall most SMT packages. The system features multiple modes of operation, adjustable temperature and air flow, as well as a timer for repeatable operations. Using the integral, hot gas jet, the unit can be configured to trace the land pattern of QFPs, SOICs, TSOPs, or to make concentric passes over area array packages. The JTF 350 includes a fully adjustable work platform capable of holding most PCBs and comes with a board support and a vacuum wand for placing or lifting components from the PCB.
The system is self-contained and requires no external vacuum or air supplies.
Specifications
| Power Requirements: | JTF 350: 120 VAC, 60 Hz, 360 Watts JTF 350E: 230 VAC, 50 Hz, 360 Watts | Dimensions: | 310mm H x 300mm W x 450mm D (12.2" H x 11.8" W x 17.7" D) | Maximum device size: | 50mm (2") square | Airflow: | 6 and 12 SLPM | Max PCB: | Maximum Length - 420 mm (16.5") | Maximum Width: | No Limit | Temperature Range: | 40?to 510° |