BGA Adapter System Part II

Mini Grid Socket

The E-tec BGA Adapter System comprises two elements, the BGA solder adapter (see Part I) and the Mini Grid Socket shown on this page. The Mini Grid Socket is soldered to the target board and is designed to accept the BGA Solder Adapter (where the chip is soldered to the adapter board). As an alternative, this Mini Grid Socket is also designed to accept the „true“ through hole BGA Sockets (where the chips can be socketed without soldering). E-tec offers any pin-out, configuration and grid size. Special terminal designs are possible on request.

Screw lock type -ZIF lever lock type- Knob lock type Solderless compression type ............Footprints: 1.27mm pitch - 1.00mm pitch - 0.80mm pitch -............. special footprints Special info - Tool

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